Bond strength measurement is far from the highest profile portion of the electronic and semiconductor industries but it has matured with it, in some cases unnoticed. This doesn’t alter the fact that a precise knowledge of bond strength quality measurement during product design and subsequent manufacture is directly related to product success, customer satisfaction and profitability. To serve this need, a modern bond test system must be capable of accurately testing bond wires, solder bumps, dies, leads, chips and lids, as well as other applications with strengths varying from a few grams of force to as much as hundreds of kilograms of force.
PicoTech offers a variaty of tools supporting the most challenging applications with exceptional measurement accuracy, suitable for R&D and production as well.
o XYZTEC is the technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester on the market, combining the unique strengths of the Condor series with the latest technologies and innovations. Are you doing ball shear, die shear, wire pull, tweezer pull or other bond test types? Contact us for more information and allow us to explain why you should never settle for anything less than a Condor Sigma with Revolving Measurement Unit (RMU), the bond test types?