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DISCO Basic Blade Seminar

• Processing mechanism
• Elements of structure
• Correct use of blades
• Application sample
• US Dicing

DISCO Basic Wheel Seminar

• Use and structure of the grinding wheel
• Processing mechanism
• Elements of structure
• Effect of grinding conditions
• Usage of the wheel
• Application sample

DISCO Laser Dicing Technology

• DISCO Laser dicing technology
• Background of development
• Laser processing method
• Processing method of laser saw
• Advantages of DISCO laser dicing technology
• Laser ablation
  • Application sample
  • Hasen cutting
• Stealth dicing (SD)
  • Application sample
  • Introduction of SDE03
• Application of sapphire processing
  • Sapphire SD
  • Sapphire scribe
• Unit line-up Application sample non silicon material

 

Special Advanced Dicing & Grinding Solutions

• TAIKO
• DBG / SDBG
• Edge Trimming
• High spec DFD
• High accuracy blade
• High-accuracy height control system
• Solution of blade tip clogging issue

Introduction to Dicing-Grinding Service (DGS)

Cascade Parametric Solution Probing on small pads & Narrow Scribe-lines

Die Bonding – Challenging applications