Picotech holds a portfolio of advanced Flip Chip Bonding, Die Bonding and Pick and Place tools, manual semiautomatic and automatic with exceptional accuracy down to 0.5um. Please contact us for more information
Picotech holds a portfolio of advanced Flip Chip Bonding, Die Bonding and Pick and Place tools, manual semiautomatic and automatic with exceptional accuracy down to 0.5um. Please contact us for more information
